From the source
NVIDIA is describing how accelerated computing, physics-based AI, agents and digital twins are shortening the analysis work that semiconductor fab engineers do before committing to physical trials.
- The company says multiphysics simulations that once took days can now be run faster and in greater number, letting engineers compare more alternatives before a wafer goes to print.
- COMSOL is using the NVIDIA cuDSS library to accelerate multiphysics simulations for semiconductor manufacturing by up to 10x, and Applied Materials' Ginestra platform runs up to 10x faster with cuDSS while its ACE+ platform delivers topography simulations up to 35x faster with NVIDIA PhysicsNeMo.
- Siemens is integrating NVIDIA cuLitho into its Calibre lithography software for up to 17x acceleration on key simulation workloads, which NVIDIA says expands what engineers can verify before printing.
- Lam Research demonstrated that PhysicsNeMo can predict plasma behavior in milliseconds, against days for a full simulation, and Advantest is using NVIDIA NeMo Switchyard agents to cut model-selection response times from hours to minutes.
- Applied Materials also builds digital twins of entire fabs with NVIDIA Omniverse libraries, so teams can simulate material movement and evaluate layouts before changing the line.
