Nvidia has asked Samsung, SK Hynix and Micron to use TSMC's 3nm process for the base die of its custom NVHBM memory, aiming to standardize production across suppliers.
Nvidia's request aims to standardize the base-die design across suppliers, reducing the need for separate validation of each vendor's version.
Samsung and Micron have confirmed they have agreed to Nvidia's request, with volume production expected in 2027.
Samsung is also validating base-die production on its own 2nm process as a backup if TSMC cannot supply enough.
